Burn-In Test Solutions

Burn-In Test Solution

Custom burn-in test fixtures that withstand extreme temperatures up to 180°C, with a modular design that greatly shortens development time. C.C.P. proprietary WJ3 plating material runs reliably in harsh environments for 1,000 to 3,000 hours.

≤180°C

Max. Operating Temperature

3000hrs

Max. Test Duration

0.3mm

Min. Pitch

Burn-In Test Solutions

Burn-In Test Solution

Burn-in testing exposes the DUT to a harsh environment: 150°C, 85% relative humidity and a continuous 1A current for up to 1,000 hours. C.C.P. uses a modular design of standard parts plus custom machined parts, which greatly shortens development time and lowers tooling cost.

BGA / CSP

QFN / QFP

Custom IC

Design Concept

Modular Design Concept

STANDARD PART

Standard Part (Insert Molding)

Manufactured by insert molding as a general-purpose part, available quickly and at lower production cost.

MACHINING PART

Custom Machined Part (CNC)

CNC machined to the customer IC design, customizable for any IC size and pin configuration.

WJ3 Special Plating Material

C.C.P. proprietary WJ3 plating material is extremely hard and runs reliably at 150°C for 1,000 hours — and in some cases up to 3,000 hours — providing the most dependable solution for the industry harshest burn-in environments.

Specifications

Product Specifications

SpecificationValue
IC Size<15×15 mm²
Min. Pitch0.3 mm
Shell MaterialPES (black)
Housing MaterialUltem 2300
Operating Temperature-55°C ~ 180°C

Applications

Key Applications

BURN-IN TESTING

Burn-In Test Solution

Custom burn-in test fixtures that withstand extreme temperatures up to 180°C, suitable for life verification of all kinds of IC components. The special WJ3 plating material keeps operation stable over long runs.

Withstands operating temperatures up to 180°C

Supports 1,000 to 3,000 hours of continuous testing

Fixtures customized to the IC design, shortening development time

IC RELIABILITY

IC Reliability Verification

For reliability verification of BGA, QFN, CSP and other packages. The special plating material maintains stable electrical performance even in harsh environments.

Supports BGA, QFN, CSP and other packages

High-hardness WJ3 plating resists wear

Modular design lowers tooling cost and development time

Cannot Find the Specification You Need?

C.C.P. provides custom solutions. Have a special requirement? Our engineers are ready for your challenge.

Thank you for your interest — download below