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Testing Solutions

C.C.P. Contact Probes provides complete testing solutions from ultra-fine IC probes and burn-in testing to wafer-level packaging testing and PCB test probes, serving semiconductor industry leaders such as Foxconn, Intel, Skyworks, and SPIL.

About Testing Solutions

Professional Expertise in Semiconductor Testing

With over 30 years of expertise in semiconductor test probes, we provide a complete product line ranging from ultra-fine 0.07mm IC probes to high-current test solutions. Our engineers work closely with clients, offering both standardized and fully customized options to ensure our test solutions precisely meet your needs.

Serving industry leaders such as Foxconn, Intel, Skyworks, and SPIL.

Standard Test Probes

Standard Test Probes

IC Test Probes

IC test probes support ultra-fine pitches as small as 0.12mm, offering over 80 design options to meet a wide range of semiconductor packaging test requirements.

80+ Design Options

0.12mmMin. Pitch

ICT Test Probes

Suitable for various PCB testing applications, featuring 70 design variants. In addition to standardized products, custom-designed solutions are also available to meet complex testing requirements.

70+ Design Options

Custom Options Available

Providing over 30 different specifications of high-current battery test probes, designed for various battery types and testing environments.

30+ Design Options

High Current Designs

Advanced Solutions

Wafer-Level Package Testing

With a minimum pitch of 0.12mm, C.C.P. Contact Probes’ proprietary wafer-level testing solutions are designed for the most advanced packaging processes.

0.12mm Min. Pitch 

RF / High-Frequency Test Solutions

C.C.P. Contact Probes’ patented high-frequency test solutions feature coaxial probe designs and pressurized conductive rubber fixtures, supporting frequencies up to 77 GHz.

≤ 77 GHz Max. Frequency 

Patented Design

High Current IC Test

Patented probe designs with current ratings exceeding 5A, ideal for high-power components and rigorous power IC testing environments.

> 5A Current Rating

PatentsDesign

Specialized Testing

Burn-In Testing

Customized burn-in test fixtures designed to withstand extreme temperatures up to 180°C, ideal for life cycle validation across various IC components.

≤ 180°COperating temperature

Customfixtures

Memory Testing

Providing standardized and customized testing solutions for a wide range of memory chips, including RAM, DDR, and flash memory.

DDR / RAM

FlashMemory

Kelvin Contact

Specially engineered for low-resistance precision measurements, this series offers probe sizes ranging from 0.07mm to 0.1mm with multiple tip styles available to ensure ultimate measurement accuracy.

0.07mmMin. Pitch

Low-ResistanceTesting

Fine Pitch Connector

Constructed with ceramic or aluminum materials, these fixtures support a minimum pitch down to 0.3mm and deliver an exceptional lifespan of up to 30,000 cycles, ensuring robust and reliable performance.

≤ 0.3mmMin. Pitch

30,000Cycle Lifespan

More Solutions

General Final Test

C.C.P. Contact Probes researches, designs, and manufactures advanced test fixtures, delivering integrated final test solutions spanning from individual components to complete systems.

Connectivity Solutions for Automation Equipment

Featuring high-frequency capabilities, our pogo pin towers and quad-pin blocks deliver customized connectivity solutions tailored for automated test equipment (ATE).

Panel Testing Solutions

With a minimum pitch of 0.45mm, C.C.P. Contact Probes  offers specialized probe cards and test fixture assemblies for precise panel and display testing applications.

0.45mm Min. Pitch 

Other Product Lines

Other Product Lines

Can't find the testing solution you need?

C.C.P. Contact Probes offers a wide range of test fixtures and probes. Do you have special requirements or need a custom design?
Our professional engineers are ready for your challenge, with over 20,000 connector options and customized solutions.

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