C.C.P. has more than 25 years of experience developing and manufacturing test fixtures and probes, with over 300 custom probe designs. Supports BGA, QFN, QFP, LGA, CSP and other packages, pitches from 0.2 to 2.2mm, and probe life over 200,000 cycles.
Custom Probe Designs
Min. Pitch
Probe Life (cycles)
General Final Test
C.C.P. has more than 25 years of experience developing and manufacturing test fixtures and probes. Through continuous improvement of materials and processes, we have developed over 300 custom probe designs and 50 special probes capable of handling high current, high temperature or high-frequency data transmission.
BGA
QFN / QFP
LGA / CSP
Pitch Range
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Specifications
| Specification | Value |
|---|---|
| IC Package Size | 1.5×1.5 ~ 38×38 mm² |
| Min. Pitch | 0.2 mm |
| Material | Torlon 4203 / Torlon 5530 / PEEK / PEEK Ceramic / SCP 5000 |
| Data Rate | 6 / 8 / 12 Gbps |
| Probe Life | >200,000 cycles |
Applications
IC FINAL TEST
Suitable for BGA, QFN, QFP, LGA, CSP and other packages with pitches from 0.2 to 2.2mm. C.C.P. offers both standard and custom test solutions.
Supports BGA, QFN, QFP, LGA and CSP packages
Pitch range 0.2mm to 2.2mm
Probe life over 200,000 cycles lowers maintenance cost
HIGH SPEED / HIGH FREQUENCY
For high-speed data ICs (6 to 12 Gbps), C.C.P. has developed more than 50 special probes that handle high current, high temperature and high-frequency data transmission for demanding requirements.
Supports 6 / 8 / 12 Gbps high-speed data transmission
Over 300 custom probe designs available
In-house turning and plating facilities for fast lead times
C.C.P. provides custom solutions. Have a special requirement? Our engineers are ready for your challenge.
