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CCP provides complete AI server solutions — from high-current power contacts to thermal structures. P5650FH05 15A High-Current Pogo Pin; Crown Spring terminal LLCR ≤5mΩ / 10,000 insertion cycles; HTB02 Magnesium Alloy ≥100 W/m·K thermal conductivity, 3× corrosion resistant; Ultra-Thin Stamped Spring 3.5A / Zero Interruption.
Common Challenges
AI/GPU servers place extreme demands on connectors and structural materials across high power density, thermal management, signal integrity, and hot-swap power.
GPU High-Current Power Supply
A single AI accelerator card requires 400~700W continuous power. Pogo Pins rated below 5A require multiple parallel connections, wasting space and increasing contact resistance.
High Power Density Thermal Management
42U rack power density has risen to 30~50kW. GPU chip surface heat flux exceeds 150 W/cm². Aluminum heatsinks are insufficient in thermal conductivity, and their weight limits structural design.
Hot-Swap Power Durability
Data center PDUs and power modules require frequent hot-swapping (thousands of times per year), causing rising LLCR, contact resistance degradation, and potential arc risk.
Backplane Signal Integrity
100G/400G high-speed signals pass through backplane Riser Cards. Traditional Pogo Pin dimensions and signal interruptions cause bit errors, affecting AI model training convergence.
CCP Capabilities
CCP offers 4 core products covering AI servers — from GPU high-current contacts and thermal housings to PDU hot-swap power and backplane signal contacts.
P5650FH05 High-Current Pogo Pin
15A rated current, low contact resistance, compact form — for GPU/CPU accelerator card edge power contacts. Reduces parallel connections and saves board space.
Crown Spring High-Current Connector
Crown spring terminal (copper alloy, silver-plated): LLCR ≤5mΩ, ≥10,000 cycles, IP67, 1000V AC — for rack backplane high-current connections and PDU hot-swap.
HTB02 Die-Cast Magnesium Alloy Thermal
≥100 W/m·K thermal conductivity (matching ADC12 aluminum) + 3× corrosion resistance (vs AZ91D) — for GPU/CPU heatsinks, server chassis, and Vapor Chamber frames.
Ultra-Thin Stamped Spring Contact Module
Stamped spring + molded housing: 0.50mm compression height, 3.5A current, zero signal interruption — for backplane Riser Card signal contacts and high-density multi-PIN arrays.
Application Positions
CCP’s 4 core products cover key positions in AI/GPU servers — from GPU power contacts and thermal housings to PDU high-current connections and backplane signal contacts.
15A rated current, low contact resistance, compact form — for AI accelerator card (GPU/TPU) edge power contacts. Reduces parallel connections, improves power stability, supports 400~700W supply.
P5650FH0515AHigh Current
≥100 W/m·K thermal conductivity (matching ADC12 aluminum) + 3× corrosion resistance (vs AZ91D) — for GPU/CPU thermal housings and Vapor Chamber frames, dissipating heat flux exceeding 150 W/cm².
HTB02≥100 W/m·KThermal Fins
Crown spring terminal (copper alloy, silver-plated): LLCR ≤5mΩ, ≥10,000 cycles, IP67, 1000V AC, -40~+85°C — for PDU hot-swap, rack backplane high-current connections, and three-phase ABC power terminals.
Crown SpringLLCR ≤5mΩ10,000×
0.50mm compression height, 3.5A current, zero signal interruption — for Riser Card signal contacts, high-density multi-PIN arrays, and 100G/400G high-speed signal backplanes ensuring signal integrity.
HCS00349MM1-R30.50mmZero Interruption
Reference Solutions
CCP provides 4 core products for AI servers and data infrastructure — covering GPU high-current contacts, thermal housings, PDU power connectors, and backplane signal contacts.
