C.C.P. has designed more than 30 probe heads for the WLCSP market, with a minimum pitch of 0.15mm and support for up to 32 test sites in parallel. Our in-house high-precision equipment machines holes down to Φ60μm, with probe life over 300,000 cycles.
Min. Pitch
Max. Test Sites
Probe Life (cycles)
Wafer-Level CSP Test
C.C.P. has designed more than 30 probe heads for the WLCSP market. The spring-probe design improves probe head durability, and a 250μm working stroke compensates for coplanarity error caused by variation in solder ball size. Our in-house high-precision machining equipment produces holes down to Φ60μm.
WLCSP
Min. pitch 0.15mm
Up to 32 sites
Specifications
| Specification | Value |
|---|---|
| Min. Pitch | 0.15 mm |
| Max. Site Counts | 32 sites |
| Top Plate Material | Photoveel® / VESPEL® SCP5000 |
| Mounting Plate Material | Torlon® 5530 |
| Bottom Plate Material | VESPEL® SCP5000 |
| Probe Life | >300,000 cycles |
Applications
WLCSP TESTING
Designed for WLCSP (Wafer-Level Chip Scale Package) with a minimum pitch of 0.15mm. The C.C.P. spring-probe design avoids coplanarity error and ensures even contact on every solder ball.
Min. pitch 0.15mm supports high-density packages
250μm working stroke compensates for solder ball size variation
Probe life over 300,000 cycles
MULTI-SITE
Supports up to 32 test sites in parallel. Combined with high-precision equipment capable of Φ60μm holes, it suits high-density IC volume production testing.
Up to 32 sites tested in parallel
Machines holes down to Φ60μm
VESPEL / Photoveel materials ensure stability
C.C.P. provides custom solutions. Have a special requirement? Our engineers are ready for your challenge.
