C.C.P. provides comprehensive test probe solutions covering ultra-fine pitch designs, high-frequency testing and patented mirror-finish technology, serving semiconductor industry leaders such as Intel, Skyworks and SPIL.
Pitch Capability · IC Testing
We supply spring probes with pitches below 0.12mm and develop and manufacture every type of test fixture.
We develop and manufacture every type of test fixture
High Frequency · RF Testing
Growing bandwidth demands ever higher frequencies. With the arrival of the 5G era, frequencies above 40GHz call for powerful, reliable test solutions.
Max. Supported Test Frequency
5G Application Frequency Coverage
Min. Supported Probe Pitch
Patent Technology · Mirror Process
During testing, solder dust gradually builds up on the probe tip and lowers conductivity. The patented C.C.P. mirror-finish technology makes the probe tip as smooth as a mirror so dust cannot adhere.
Fewer cleaning cycles and less test machine downtime
Durability improved by 50%
Better signal transmission efficiency
Innovation · We Care
We own the complete production technology and process. Every probe and fixture is designed and manufactured by C.C.P. and passes a rigorous, comprehensive quality inspection to guarantee the high standards you expect.
C.C.P. invests more than 10% of revenue in research and development every year, keeping our products at the leading edge of technology.
Our R&D team includes many senior engineers with over 30 years of experience in the semiconductor test industry — extra effort, all to find the right solution for you.
R&D Investment 10%+
Engineer Experience 30+ years
Selected Customers
Semiconductor industry leaders including Foxconn, Intel, Skyworks and SPIL are long-standing C.C.P. customers.
Applications
IC test probes are used for semiconductor package testing and ICT test probes for PCB testing. They serve different stages of the test process and can be selected separately as needed.
Find Products
Once you have identified your application, go to the product search page and filter by length, outer diameter, tip type and other specifications to find the best probe model.
Group A · IC Testing
80+ designs, minimum pitch 0.12mm, supporting QFN / BGA / WLCSP and other packages. Filter by structure, length and DUT tip type.
Group B · PCB Testing
70+ designs for all kinds of PCB testing, with custom designs available beyond the standard range. Filter by length, outer diameter and tip type.
C.C.P. engineers have over 30 years of experience in the semiconductor test industry and can recommend the most suitable probe design and customization plan.
