CCP provides complete solutions for consumer electronics from charging interfaces to structural materials — PSG substitute gold plating: salt spray >120H, cost reduced 50%; ultra-thin stamped spring: 0.50mm / 3.5A, zero signal interruption; HTB02 / YGB1 magnesium alloy: 3× corrosion resistance + ≥280 MPa yield strength.
Common Challenges
From mid-range charging interfaces to structural components, consumer electronics manufacturers face multiple challenges in cost, thin profiles, lightweight design, and durability.
BOM Cost Pressure
Mid-range device charging PINs using standard 10μ gold plating face high costs, with borderline salt spray (only 48H) and sweat resistance — limiting cost performance.
Ultra-Thin Profile Limits
Ultra-thin tablets require charging contact compressed height of 0.50mm — below the structural limits of conventional Pogo Pins, with frequent signal interruption at low travel.
Lightweight vs. Strength
AZ31B extruded magnesium sheet strength of only ~160 MPa is insufficient; switching to heavier AL6061 sacrifices the weight advantage of magnesium alloy.
High-Temperature / High-Humidity Durability
Outdoor electronics (such as drones) and 3C heat dissipation enclosures require both corrosion resistance and thermal conductivity — standard AZ91D die-cast magnesium alloy falls short.
CCP Capabilities
CCP covers two core technology pillars for consumer electronics — contact interfaces and structural materials — providing complete solutions from plating to alloy.
PSG Substitute Gold Plating
Proprietary substitute gold plating system: salt spray >120H, sweat >120H — 2.5× improvement over standard 10μ gold plating, ~50% cost reduction.
Ultra-Thin Stamped Spring Structure
Stamped spring + molded housing replaces conventional Pogo Pin — achieving 0.50mm compressed height, 3.5A current, zero signal interruption. (Patent pending)
HTB02 Die-Cast Magnesium Alloy
The only die-cast magnesium alloy on the market combining both properties: 3× corrosion resistance (vs AZ91D) + ≥100 W/m·K thermal conductivity (matching ADC12 aluminum alloy).
YGB1 High-Yield Magnesium Sheet
≥280 MPa yield strength (vs AZ31B baseline 160 MPa, +75%) — can replace AL6061 aluminum alloy for smartphone mid-frame structures.
Application Positions
CCP’s 4 core products cover key positions from charging interfaces to structural materials — PSG charging PIN, ultra-thin stamped spring, HTB02 / YGB1 magnesium alloy.
J11650FH1-3 uses PSG substitute gold plating: salt spray >120H, sweat >120H — 2.5× improvement over standard gold plating, ~50% cost reduction. For entry-level smartwatches, true wireless earphone charging cases, and IoT peripheral charging.
J11650FH1-3 | PSG Plating | EVT
HCS00349MM1-R3 replaces conventional Pogo Pin with a stamped spring + molded housing, achieving 0.50mm compressed height, 3.5A current, zero signal interruption. Patent pending.
HCS00349MM1-R3 | 0.50mm / 3.5A | Zero Interruption
3× corrosion resistance + ≥100 W/m·K thermal conductivity (matching ADC12) — the only die-cast magnesium alloy combining both properties. For drone frames, VR/AR enclosures, thin-and-light laptop bodies, and heat dissipation enclosures.
HTB02 | 3× Corrosion Resistance | ≥100 W/m·K
≥280 MPa yield strength (vs AZ31B baseline 160 MPa, +75%) — strength matching AL6061 at lower weight. For smartphone mid-frames, laptop bodies, and semiconductor equipment brackets.
YGB1 | ≥280 MPa | AL6061 Replacement
Reference Solutions
CCP offers 4 core products for consumer electronics — covering charging interfaces (PSG plating, ultra-thin stamped spring) and structural materials (HTB02 / YGB1 magnesium alloy).
